TAILIEUCHUNG - Handbook of algorithms for physical design automation part 76

Handbook of Algorithms for Physical Design Automation part 76 provides a detailed overview of VLSI physical design automation, emphasizing state-of-the-art techniques, trends and improvements that have emerged during the previous decade. After a brief introduction to the modern physical design problem, basic algorithmic techniques, and partitioning, the book discusses significant advances in floorplanning representations and describes recent formulations of the floorplanning problem. The text also addresses issues of placement, net layout and optimization, routing multiple signal nets, manufacturability, physical synthesis, special nets, and designing for specialized technologies. It includes a personal perspective from Ralph Otten as he looks back on. | 732 Handbook of Algorithms for Physical Design Automation 12. . Ouma . Boning . Chung W. Easter V. Savene S. Misra and A. Crevasse Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts IEEE Transactions on Semiconductor Manufacturing 15 2 232-244 2002. 13. A. Srivastava D. Sylvester and D. Blaauw Statistical Analysis and Optimization for VLSI Timing and Power Springer New York 2005. 14. W. Maly Computer-aided design for VLSI circuit manufacturability Proceedings of IEEE 78 2 356-390 Feb. 1990. 15. W. Maly and J. Deszczka Yield estimation model for VLSI artwork evaluation Electronics Letters 19 6 226-227 1983. 16. . Ferris-Prabhu Role of defect size distributions in yield modelling IEEE Transactions on Electron Devices ED-32 9 1727-1736 1985. 17. . Stapper Modeling of integrated circuit defect sensitivities IBM Journal of Research and Development 27 6 549-557 1983. 18. . Allan and . Walton Hierarchical critical area extraction with the EYE tool in Proceedings of the IEEE Workshop Defect Fault Tolerance in VLSI Systems pp. 28-36 Nov. 1995. 19. W. Maly . Heineken and F. Agricola A simple new yield model Semiconductor International pp. 148-154 July 1994. 20. I. Bubel W. Maly T. Waas . Nag H. Hartmann D. Schmitt-Landsiedel and S. Griep AFFCCA A tool for critical area analysis with circular defects and lithography deformed layout in Proceedings of the IEEE International Workshop on Detect and Fault Tolerance in VLSI Systems pp. 19-27 IEEE Computer Society Press 1995. 21. H. Levinson Principles of Lithography 2ndedn. SPIE Press Bellingham WA 2005 or Microlithography Science and Technology 2nd edn. K. Suzuki and . Smith Eds. CRC Press Boca Raton FL 2007. 22. . Willson Organic resist materials Introduction to Microlithography 2nd edn. L. Thompson . Willson and M. Bowden Eds. American Chemical Society Washington DC 1994. 23. The International Technology Road Map for .

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