TAILIEUCHUNG - THE MANUFACTURING PROCESS

Assembling electrical and mechanical parts is a costly and error-prone step in the process of making electronic devices. The Fab@Home team at Cornell is pursuing the holy grail of personal fabrication, the ability to manufacture, on a single 3D printer machine in a single “print job,” an object that contains a battery, actuators, sensors, and a physical “body.” In other words a robot. Today’s 3D printers are already capable of combining and manufacturing previously incompatible materials, namely simple electrical components and mechanical parts, called electro mechanical devices. Your cell phone or laptop (or Roomba) is. | Page 33 Monday September 4 2000 11 11 AM CHAPTER THE MANUFACTURING PROCESS Overview of manufacturing process Design rules IC packaging Future Trends in Integrated Circuit Technology Introduction Manufacturing CMOS Integrated Circuits The Silicon Wafer Photolithography Some Recurring Process Steps Simplified CMOS Process Flow Design Rules The Contract between Designer and Process Engineer Packaging Integrated Circuits Package Materials Interconnect Levels Thermal Considerations in Packaging Perspective Trends in Process Technology Short-Term Developments In the Longer Term Summary 33 Page 34 Monday September 4 2000 11 11 AM 34 THE MANUFACTURING PROCESS Chapter 2 Introduction Most digital designers will never be confronted with the details of the manufacturing process that lies at the core of the semiconductor revolution. Yet some insight in the steps that lead to an operational silicon chip comes in quite handy in understanding the physical constraints that are imposed on a designer of an integrated circuit as well as the impact of the fabrication process on issues such as cost. In this chapter we briefly describe the steps and techniques used in a modern integrated circuit manufacturing process. It is not our aim to present a detailed description of the fabrication technology which easily deserves a complete course Plummer00 . Rather we aim at presenting the general outline of the flow and the interaction between the various steps. We learn that a set of optical masks forms the central interface between the intrinsics of the manufacturing process and the design that the user wants to see transferred to the silicon fabric. The masks define the patterns that when transcribed onto the different layers of the semiconductor material form the elements of the electronic devices and the interconnecting wires. As such these patterns have to adhere to some constraints in

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