TAILIEUCHUNG - Simulation of cutting locus and overlap cutting by diamond dressing in cmp process

This paper aims to apply a kinematic model and then propose a method for setting speeds for diamond dressing process on the current configuration of CMP tool. | Simulation of cutting locus and overlap cutting by diamond dressing in cmp process International Journal of Mechanical Engineering and Technology IJMET Volume 10 Issue 03 April 2019 pp. 1615 1622 Article ID IJMET_10_02_162 Available online at http ijmet JType IJMET amp VType 10 amp IType 3 ISSN Print 0976-6340 and ISSN Online 0976-6359 IAEME Publication Scopus Indexed SIMULATION OF CUTTING LOCUS AND OVERLAP CUTTING BY DIAMOND DRESSING IN CMP PROCESS Quoc-Phong Pham School of Engineering and Technology Tra Vinh University Vietnam Nguyen Vu Luc School of Engineering and Technology Tra Vinh University Vietnam Thi Tran Anh Tuan School of Basic Science Tra Vinh University Vietnam Chao-Chang A. Chen Department of Mechanical Engineering National Taiwan University of Science and Technology Taiwan. Corresponding Author ABSTRACT Diamond dressing plays a role in regenerating the polishing pad surface during Chemical Mechanical Planarization Polishing process CMP . The diamond dresser has many diamond grits distributed on the flat metal surface. During diamond dressing cutting locus CL and overlap cutting points OP of diamond grits are created on the pad surface. Expectation of diamond dressing is that CL and OP must be covered all the pad surface and maintain soften flatten and roughness of the polishing pad. This paper aims to apply a kinematic model and then propose a method for setting speeds for diamond dressing process on the current configuration of CMP tool. Prediction of CL and OP is implemented based on three main factors as rotational speed of pad rotational speed on dresser and oscillation of dresser. It found that properly choose the speed of pad and speed of dresser can regenerate uniformity of pad surface with well- distributed CL and less OP density. This result can be applied to optimization CMP process. Key words Diamond dressing Cutting locus overlap cutting Kinematic model CMP Cite this Article Quoc-Phong Pham Nguyen Vu Luc Thi .

• Cơ khí - Chế tạo máy
• Diamond dressing process
• Configuration of CMP tool
• Chemical Mechanical Planarization/Polishing process
• Overlap cutting points
• Expectation of diamond dressing
• Pad cutting rate
• Surface roughness
• Simulation results where high PCR
• CMP tool parameters