TAILIEUCHUNG - Effect of bath temperature for cu electroless deposition onto acrylon nitril butadiene (ABS) insulating substrate

In this work, we will show results of study on the influences of bath temperature on deposition rate and structure, morphology, mechanical properties of Cu electrolessly deposited films onto Acrylon Nitril Butadiene (ABS) surface. | Journal of Chemistry Vol. 44 5 P. 642 - 647 2006 EFFECT OF BATH TEMPERATURE FOR Cu ELECTROLESS DEPOSITION ONTO ACRYLON NITRIL BUTADIENE ABS INSULATING SUBSTRATE Received 8 August 2005 MAI THANH TUNG LAI HUY NAM Dept. of Electrochemistry and Corrosion Protection Hanoi University of Technology SUMMARY Influences of bath temperature Tbath on Cu electroless deposition rate and on morphology structure corrosion resistivity of deposited Cu layers were investigated. Results showed that the increasing Tbath from 25 to 70oC resulted an increase of the deposition rate while the deposition rate decreased as Tbath increased from 70 to 90oC due to the bulk reduction of Cu2 . SEM results indicated that the crystals of deposited layers became finer as Tbath increased. XRD analyses showed that mean grain size Lmean decreased and intensity ratio I 111 I 200 increased remarkably with increasing Tbathfrom 25 to 70oC and changes of both Lmean and I 111 I 200 are less pronounce in the range of Tbath 70 - 90o. The corrosion resistivity increased remarkably with increasing Tbath from 25 to 70oC and became nearly invariable the range of Tbath 70 - 90o. These results were explained by the relation between structure and corrosion properties of the electrolessly deposited Cu layers. I - INTRODUCTION Electroless deposition technique has been intensively studied due to its important applications in electronics surface technology and modern micro- and nanotechnology 1 - 4 . The main advantage of the electroless deposition technique is the possibility to form metal layers on insulating and semiconducting substrates. Among the metals used for electroless deposition Cu is one of the most important materials due to its high conductivity and good mechanical properties. Therefore the Cu electroless deposition became the key process in printed circuit boards PCBs production and metallization process in plastic industry 1 - 7 . The Cu electroless deposition process is based on the so-called .

• Hoá học
• Bath temperature
• Electroless deposition onto acrylon
• Nitril butadiene
• Insulating substrate
• Hóa vô cơ
• Công nghệ hóa
• Kỹ thuật hệ thống công nghệ hóa học
• Hệ thống công nghệ hóa học
• Công nghệ hóa học
• Tối ưu hóa
• Quá trình công nghệ hóa học
• Phương pháp giải thích
• Quy hoạch toán học
• Phương pháp gradient
• Mô hình hóa công nghệ hóa học
• Nghiên cứu công nghệ hóa học
• Mô tả công nghệ hóa học
• giáo trình công nghệ hóa học
• thiết bị công nghệ hóa học
• bài giảng công nghệ hóa học
• công nghệ hóa chất
• tài liệu công nghệ hóa chất
• áp dụng công nghệ hóa chất
• tìm hiểu công nghệ hóa chất
• nghiên cứu công nghệ hóa chất
• công nghệ hóa dầu
• bài giảng công nghệ hóa dầu
• giáo trình công nghệ hóa dầu
• tài liệu công nghệ hóa dầu
• lý thuyết công nghệ hóa dầu