TAILIEUCHUNG - Packing and Characterizing High- power Laser Diode
This paper presents the packaging of high-power laser diode modules from single chip, evaluating the electro-optical characteristics and the beam quality of the modules. The obtained results show that the packaged module has an output optical power of 5 W at current A; the Operation Voltage is V; the Threshold Current is 1,0 A; the Divergence Angle Mean is degree and the Asymmetry is . | VNU Journal of Science: Mathematics – Physics, Vol. 32, No. 3 (2016) 76-85 Packing and Characterizing High- power Laser Diode Nguyen Tuan Anh1,*, Didier Decoster2, Au Thi Huong2 1 NACENTECH, 25 Le Thanh Tong, Hoan Kiem, Hanoi, Vietnam 2 PolyTech lille, University Lille 1, France Received 16 August 2016 Revised 15 September 2016; Accepted 09 September 2016 Abstract: In the manufacturing processes of high-power laser diode modules, the module packaging technologies play an important role; decide the efficiency of the electro-optical conversation, the beam quality and the lifetime. This paper presents the packaging of high-power laser diode modules from single chip, evaluating the electro-optical characteristics and the beam quality of the modules. The obtained results show that the packaged module has an output optical power of 5 W at current A; the Operation Voltage is V; the Threshold Current is 1,0 A; the Divergence Angle Mean is degree and the Asymmetry is . These parameters are almost the same that of some on-stock modules. Thus, the application of the packaged module in social – economics is possible. Keywords: Laser diode, fiber – coupled, die bond technology; wire bond technology; electrooptical conversation efficiency, PVI characteristics, beam quality, Divergence Angle, Asymmetry. 1. Introduction The revolution of semiconductor laser technology in the last decades has made the adoption of high-power laser diodes more affordable [1]. The advantages of high-power laser diodes in terms of compactness, energy efficiency, and lifetime and running costs have been increasingly recognized. Nowadays, high-power laser diodes are sufficient for many different applications such as pumping of solid state lasers, material processing, medical applications, the successful applications of high-power diode lasers depend on their high reliability in combination with a long lifetime. However, the packaging of a high-power laser diode is time and effort .
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