TAILIEUCHUNG - Intel ® X58 Express Chipset Thermal and Mechanical Design Guide

Three-dimensional models can be made accurately enough by RP methods to evaluate the design process and eliminate interference fits or dimensioning errors before production tooling is ordered. If design flaws or omissions are discovered, changes can be made in the source CAD program and a replacement model can be produced quickly to verify that the corrections or improvements have been made. Finished models are useful in evaluations of the form, fit, and function of the product design and for organizing the necessary tooling, manufacturing, or even casting processes | Intel X58 Express Chipset Thermal and Mechanical Design Guide November 2009 Document Number 320840-003 jntei INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMeNt. except as PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS including LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A particular purpose merchantability or infringement of any PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical life saving or life sustaining applications. Intel may make changes to specifications and product descriptions at any time without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel X58 Express Chipset IOH may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel and the Intel logo are trademarks of Intel Corporation in the . and other countries. Other brands and names may be claimed as the property of others. Copyright 2008-2009 Intel Corporation. 2 Thermal and Mechanical Design Guide jntei Contents 1 Design Definition of Reference 2 Packaging Non-Critical to Function Solder Joints . 11 Package Mechanical 3 Thermal Thermal .

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