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Tham khảo tài liệu 'solid state circuits technologies part 11', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | 292 Solid State Circuits Technologies Where E and E are the transmitter energies in case of with and without misalignment respectively. Z and Z are the equivalent communication distances with and without misalignment respectively. D is the average between outer and inner diameter of inductors. AX and AY are the values of misalignment in X-axis and Y-axis respectively. Figure 15 shows the total transmitter energy dependence on the angle of the inductor where the misalignment value AR is constant. The diameter and communication distance are 80pm and 70pm. respectively. As shown in this figure the difference of transmitter energy for all angles is less than 5 . This result shows that proposed modeling can be applied to not only 1D analysis but also 2D analysis. Angle Ỡ degree 2009 IEEE Fig. 15. Normalized total transmitter energy dependence the position of the inductor. 4.2 Estimation of transmitter energy under misalignment From the above theoretical analysis we can calculate the relationship between design parameters and misalignment which is shown in Fig. 16. By referring to this figure parameter design with taking misalignment into consideration becomes possible. In order to determine the specific value of transmitter energy we targeted the BER and timing margin. However the proposed model can be applied to any BER and timing margin by scaling the transmitter energy calculated by 1 . The reason is that misalignment affects only coupling coefficiency and the relationship between BER timing margin transmitter energy and coupling coefficient is introduced in Miura et al. 2007 . In Fig. 16 the region where 1 is valid will be explained in the following discussion. As shown in Fig. 16 there are points where magnetic filed lines change the vertical direction. If the directions of all magnetic field lines in the receiver inductor are same 1 is valid. Such points were calculated from the An Inductive-Coupling Inter-Chip Link for High-Performance and Low-Power 3D System .
