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Tuyển tập các báo cáo nghiên cứu về hóa học được đăng trên tạp chí hóa hoc quốc tế đề tài : Hybrid FIB milling strategy for the fabrication of plasmonic nanostructures on semiconductor substrates | Einsle et al. Nanoscale Research Letters 2011 6 572 http www.nanoscalereslett.eom content 6 1 572 o Nanoscale Research Letters a SpringerOpen Journal NANO EXPRESS Open Access Hybrid FIB milling strategy for the fabrication of plasmonic nanostructures on semiconductor substrates Joshua F Einsle1 Jean-Sebastien Bouillard2 Wayne Dickson2 and Anatoly V Zayats2 Abstract The optical properties of plasmonic semiconductor devices fabricated by focused ion beam FIB milling deteriorate because of the amorphisation of the semiconductor substrate. This study explores the effects of combining traditional 30 kV FIB milling with 5 kV FIB patterning to minimise the semiconductor damage and at the same time maintain high spatial resolution. The use of reduced acceleration voltages is shown to reduce the damage from higher energy ions on the example of fabrication of plasmonic crystals on semiconductor substrates leading to 7fold increase in transmission. This effect is important for focused-ion beam fabrication of plasmonic structures integrated with photodetectors light-emitting diodes and semiconductor lasers. Introduction Plasmonic nanostructures are finding ever increasing number of applications in various areas of photonics and optoelectronics 1-3 . While initial investigations into the optical properties of plasmonic systems have been almost exclusively done with metallic nanostructures on passive dielectric substrates such as silica or quartz the real-world applications in many cases require the use of semiconductor substrates. Recently there has been a demand on incorporating plasmonic nanostructures in active photonic devices such as light-emitting diodes LEDs semiconductor lasers and photodetectors to improve their performance 4-7 . For applications in visible and near-infrared spectral ranges the plasmonic structures need to be fabricated with a precision on the order of tens of nanometers. Conventional microelectronics fabrication methods such as visible and UV .
