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Tham khảo tài liệu 'the materials science of coatings and substrates part 4', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | 16 Electrodeposition Table 16- Ring Shear Data Show the Value of Combining PVD with Electroplating for Coating Difficult-to-Plate Metals Melal Rine Shear Adhesion MPa Electroplating PVD Electroplating Tungsten 48 KCuý IVS iCu Molybdenum 125 kAu 216e Cu Titanium 145r Ni 252E Cu a This process included etching in 3 parts HF 1 part HNO3 and 4 parts HjO for 5 min. at 22 C followed by anodie treatment 1076 Atm2 in 300 g 1 KOH at 50 C for 5 min. prior to plating. b Metal in parenthesis was that used for building up the thick ring 1.5mm required for ring shear testing. e The magnetron ion plating process included sputter etching in vacuum magnetron ion plating with 6pm of copper and then electroplating to final thickness. Base pressure of the system was 5 X 10 Pa 10 Torr etch power was 0.5 watts cm2 and bias power was 0.078 watta cm2 but tapered to zero after deposition of about 20.000Ẳ of copper . d This process included degreasing in perchlorethylene firing in dry hydrogen 2ppm HjO for 10 min. immersing in a solution containing four parts NH4OH 28 and one part H2O2 30 for 8 to 10 Secondo at room temperature rinsing in distilled water gold striking to deposit 0.15 to 0.63 mg em2 0.08 to 0.32 pm rinsing in distilled water firing in dry hydrogen at 1000 C for 10 min. and then electroplating to final thickness. a The magnetron ion plating process included sputter etching in vacuum magnetron ion plating with 6p of copper and then electroplating to final thickness. Base pressure of the system was 5 X 1 T Pa 10 8 Torr etch power was 0.5 watts cm2 and bias power was 0.078 watis cm2 throughout the coating run. f This process ineluded abrasive blasting cleaning in hot alkaline solution pickling in HC1 bright dipping in a solution containing 10 by vol. of HF 70 1 HNO3 and balance water followed by anodie etching for 6 min. at 162Ả m2 in a 40C solution containing 13 by vol HF 70 83 acetic acid and 4 water. Then 25 pm of Ni was plated in a suVamate solution at 48 C. Specimens were .