TAILIEUCHUNG - The Materials Science of Coatings and Substrates Part 4

Tham khảo tài liệu 'the materials science of coatings and substrates part 4', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | 16 Electrodeposition Table 16- Ring Shear Data Show the Value of Combining PVD with Electroplating for Coating Difficult-to-Plate Metals Melal Rine Shear Adhesion MPa Electroplating PVD Electroplating Tungsten 48 KCuý IVS iCu Molybdenum 125 kAu 216e Cu Titanium 145r Ni 252E Cu a This process included etching in 3 parts HF 1 part HNO3 and 4 parts HjO for 5 min. at 22 C followed by anodie treatment 1076 Atm2 in 300 g 1 KOH at 50 C for 5 min. prior to plating. b Metal in parenthesis was that used for building up the thick ring required for ring shear testing. e The magnetron ion plating process included sputter etching in vacuum magnetron ion plating with 6pm of copper and then electroplating to final thickness. Base pressure of the system was 5 X 10 Pa 10 Torr etch power was watts cm2 and bias power was watta cm2 but tapered to zero after deposition of about of copper . d This process included degreasing in perchlorethylene firing in dry hydrogen 2ppm HjO for 10 min. immersing in a solution containing four parts NH4OH 28 and one part H2O2 30 for 8 to 10 Secondo at room temperature rinsing in distilled water gold striking to deposit to mg em2 to pm rinsing in distilled water firing in dry hydrogen at 1000 C for 10 min. and then electroplating to final thickness. a The magnetron ion plating process included sputter etching in vacuum magnetron ion plating with 6p of copper and then electroplating to final thickness. Base pressure of the system was 5 X 1 T Pa 10 8 Torr etch power was watts cm2 and bias power was watis cm2 throughout the coating run. f This process ineluded abrasive blasting cleaning in hot alkaline solution pickling in HC1 bright dipping in a solution containing 10 by vol. of HF 70 1 HNO3 and balance water followed by anodie etching for 6 min. at 162Ả m2 in a 40C solution containing 13 by vol HF 70 83 acetic acid and 4 water. Then 25 pm of Ni was plated in a suVamate solution at 48 C. Specimens were .

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