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In this section, fabrication as well as bonding and packaging of microstructure components and devices made from metals and ceramics will be described briefly. Themanufacturing processes of bothmetalmicrostructure components and ceramic microstructure devices will also be described setting the focus on some well- established technologies. The detailed description of all these techniques can, however, be found in Refs [1–5]. A very short bonding section in which the most common bonding and sealing techniques are briefly described will complete the description of metals and ceramics [4,6]. Two different principal manufacturing techniques, that is erosive and generative have been considered with the discussedmaterials. Following this, other techniques such as embossing ormolding are.
