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Computational heat transfer analysis of electronic equipment

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The Research area of engineering of the electronic system cooling is having wide application nowadays. Therefore, in the present work, Aluminum is chosen as the material for the heat sink. In the present work effect of various shapes of cross sections of fins on the mother board is studied keeping the inlet air velocity, temperature of the ambient and the heat generation constant. | Computational heat transfer analysis of electronic equipment

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Computational heat transfer analysis of electronic equipment

Computational Fluid Mechanics and Heat Transfer Third Edition_1

Computational Fluid Mechanics and Heat Transfer Third Edition_2

Computational Fluid Mechanics and Heat Transfer Third Edition_3

Computational Fluid Mechanics and Heat Transfer Third Edition_4

Computational Fluid Mechanics and Heat Transfer Third Edition_5

Computational Fluid Mechanics and Heat Transfer Third Edition_6

Computational Fluid Mechanics and Heat Transfer Third Edition_7

Computational Fluid Mechanics and Heat Transfer Third Edition_8

Computational Fluid Mechanics and Heat Transfer Third Edition_9

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