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Particulate leaching is one of the popular techniques that are widely used to fabricate scaffolds for tissue engineering applications (Ma & Langer, 1999; Lu et al, 2000). Salt, wax or sugars known as porogens are used to create the pores or channels. Here salt is grounded into small particles and those particles that have desired size are poured into a mold and filled with the porogen. A polymer solution is then cast into the salt-filled mold. After the evaporation of the solvent, the salt crystals are leached away using water to form the pores of the scaffold. The process. | MMIC Design and Technology Fabrication of MMIC Instructor Dr. Ali Medi Lecture 2 Fabrication Processes Process Choice Substrate - Mobility Peak Velocity Frequency Response - Band-Gap Energy Breakdown Voltage Power-Handling - Resistivity Loss and Q of the Passives Transistor - Field-Effect Transistors - Bipolar Transistors Lecture 2 Fabrication Processes Most Commonly Used Semiconductors Material Electron Mobility cm2 Vs Peak Velocity 107 cm s Frequency Range GHZ Noise Figure Gain Maturity Si 900 -1 100 0.3 -0.7 20 Moderate Moderate Mature 12-in Wafer SiGe 2 000 -300 000 0.1 -1.0 10 -40 Lower Better Mature 6-in Wafer SiC 500 -1 000 0.15-0.2 15 -20 Poor Lower 4-in Wafer GaAs 5 500 -7 000 1.6 -2.3 75 Lower Fmin 1.1 Higher Gass 9 3 4 6-in Wafers GaN 400 -1 600 1.2 -2.0 20 -30 Poor Lower 2-in Wafer InP 10 000 -12 000 2.5 -3.5 115 Lower Fmin 0.9 Higher Gass 11 2-in Wafer Lecture 2 Fabrication .