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Aluminum alloys also display high fatigue crack growth rate, as much as three times faster than in steel specimens when subjected to the same stress intensity (Czyryca et al 2006). Aluminum alloys are anodic to most other materials used in construction and therefore, susceptible to localized galvanic corrosion. They are also sensitive to stress corrosion cracking. Other concerns involve marine fouling since aluminum alloys cannot be coated with conventional Cu-based antifouling coatings. In summary, the U.S. shipbuilding industry should address the greater adoption of aluminum alloys by focusing research and development work in the areas of design, fabrication, operation,. | NANO III Chapter Micro- and nano-fabrication Michel Calame Institut fur Physik Klingelbergstrasse 82 4056 Basel room 1.20 1st floor email michel.calame@unibas.ch wo wo MC Nano III 24.04.04 1 Outline Introduction overview state of the art semiconductor physics reminder Fabrication basics - IC fabrication overview - clean-rooms - Silicon from sand to wafer - material deposition techniques - lithography - etching - examples of devices MEMS NEMS Outlook new and future techniques MC Nano III 24.04.04 2 References overview books 1. Introduction to Semiconductor Manufacturing Technology H. Xiao Prentice-Hall 2001. 2. Fundamentals of Microfabrication The Science of Miniaturization M. Madou 2nd ed. CRC Press 2002 3. Nanoelectronics and Information Technology R. Waser ed. Wiley-VCH 2003 4. VLSI Technology more physical SM. Sze 2nd ed. McGraw-Hill 1988 many web sites e.g. www.memsnet.org glossary see also companies web sites Intel Infineon IBM AMD . MC Nano III 24.04.04 3 Introduction 1947 23th December John Bardeen Walter Brattain William Schockley ATT Bell Labs first point contact transfer resistor reconstitution Aylesworth http www.pbs.org transistor MC Nano III 24.04.04 4 Introduction 1958 Jack Kilby Texas Instruments first IC Integrated Circuit MC Nano III 24.04.04 5 Introduction 1961 Robert Noyce Fairchild Camera first integrated circuit available as a monolithic chip Planar technology Si substrate and Al lines C. Esser Infineon C. Esser Infineon MC Nano III 24.04.04
