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rất nhiều trong những bước sản xuất được thực hiện song song (tức là, trong thời trang pipelined). Do đó, trong khi nó có thể mất nhiều ngày hoặc vài tuần cho một sản phẩm duy nhất để di chuyển qua các dòng chảy sản xuất, | WLAN Manufacturing Test In a high-volume manufacturing operation many of the manufacturing steps are performed in parallel i.e. in pipelined fashion . Thus while it may take days or weeks for a single product to move through the manufacturing flow the parallel operations mean that a new finished product will pop out at the end of the manufacturing line every few minutes or even seconds. Manufacturing test is squarely in the path of this high-volume process and hence test time is very expensive the expense is due to the cost of the floor space on the production line that is needed to house the test equipment the labor cost for the operators to run the equipment and the cost of the test equipment itself. All efforts are therefore made to reduce it. Manufacturers go to great lengths to design test setups and test software to maximize test coverage and minimize test time. The production screening thus usually performs a fairly cursory test rather than the comprehensive testing that occurs in verification and quality assurance QA labs. Much more comprehensive post-production tests are however done for QC and process improvement purposes. During this stage the manufacturer redirects a small percentage typically 2-10 of manufactured devices for additional extensive testing in a separate area and may also pull packaged devices off the shelf for such testing to catch issues during packaging process . These tests are done in the manufacturing facility but not on the production floor. They resemble the extensive testing performed during design and development testing processes as the limited scope permits more time and equipment to be devoted to this activity. 7.1.2 Assembly Test Assembly test is also sometimes referred to as in-circuit test or electrical test. Its purpose is simply to locate bad or missing components electrical shorts or open circuits e.g. due to cold solder joints defective PCBs etc. Access to the individual elements is accomplished in various ways such as
