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(a) Substrate covered with silicon dioxide barrier layer (b) Positive photoresist applied to wafer surface (c) Mask in close proximity to surface (d) Substrate following resist exposure and development (e) Substrate after etching of oxide layer (f) Oxide barrier on surface after resist removal (g) View of substrate with silicon dioxide pattern on the surface. • Each mask step requires many individual process steps • Number of masks is a common measure of overall process complexity | Photolithographic Process Substrate covered with silicon dioxide barrier layer Positive photoresist applied to wafer surface Mask in close proximity to surface Substrate following resist exposure and development Substrate after etching of oxide layer Oxide barrier on surface after resist removal View of substrate with silicon dioxide pattern on the surface For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN0-201-44494-1. © 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. Photolithographic Process Each mask step requires many individual process steps Number of masks is a common measure of overall process complexity For the exclusive use of adopters of the book Introduction to . | Photolithographic Process Substrate covered with silicon dioxide barrier layer Positive photoresist applied to wafer surface Mask in close proximity to surface Substrate following resist exposure and development Substrate after etching of oxide layer Oxide barrier on surface after resist removal View of substrate with silicon dioxide pattern on the surface For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN0-201-44494-1. © 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. Photolithographic Process Each mask step requires many individual process steps Number of masks is a common measure of overall process complexity For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN0-201-44494-1. © 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. Photomasks CAD Layout Composite drawing of the masks for a simple integrated circuit using a four-mask process Drawn with computer layout system Complex state-of-the-art CMOS processes may use 25 masks or more For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN0-201-44494-1. © 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. .
