tailieuchung - Dependence of the deformation of 128 x 128 InSb focal plane arrays on the silicon readout integrated circuit thickness

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Dependence of the deformation of 128 x 128 InSb focal plane arrays on the silicon readout integrated circuit thickness

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The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling. | Dependence of the deformation of 128 x 128 InSb focal plane arrays on the silicon readout integrated circuit thickness

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Dependence of the deformation of 128 x 128 InSb focal plane arrays on the silicon readout integrated circuit thickness

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