TAILIEUCHUNG - Fabrication Technology - O. Brand, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

Hyundai Heavy Industries has successfully built a large LPG cargo without using dry dock “called on-ground building method” for the first time in the world. Daewoo Shipbuilding & Marine Engineering has built Bulk and LPG carriers with “on-ground building and launching barge” mixed production method. Hanjin Heavy Industries has delivered 8400 TEU container ship, whose length was over the length of dry dock, by using “DAM Production Technology”. By this technology two parts of a ship could be erected on the sea after launching from the dock. Samsung Heavy Industries has been developed “tera-block” method that allows the company. | 1 1 Fabrication Technology O. Brand School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta GA USA Abstract This chapter provides an overview on fabrication technologies for CMOS-based microelectromechanical systems MEMS . The first part briefly introduces the basic microfabrication steps highlights a CMOS process sequence and how CMOS materials can be used for microsystems design. While a number of microsystems can be fabricated within the regular CMOS process sequence the focus of the chapter is on combining CMOS technology with micromachining process modules. CMOS-compatible bulk and surface micromachining techniques are introduced in the second part of the chapter together with an overview of the design challenges faced when combining mechanical microstructures and electronics on the same substrate. The micromachining modules can either precede preCMOS follow post-CMOS or be performed in between intra-CMOS the regular CMOS process steps. The last part of the chapter provides an extensive overview on the different CMOS-based MEMS approaches found in the literature. Keywords Micromachining CMOS-based MEMS MEMS fabrication microsystem fabrication CMOS Technology 2 Basic Microfabrication Steps 4 Thin Film Deposition 5 Patterning 6 Etching 8 Doping 9 Advanced Micro and Nanosystems. Vol. 2. CMOS - MEMS. Edited by H. Baltes O. Brand . Fedder C. Hierold J. Korvink O. Tabata Copyright 2005 WILEY-VCH Verlag GmbH Co. KGaA Weinheim IsBN 3-527-31080-0 2 I 1 Fabrication Technology CMOS Process Sequence 9 CMOS Materials for Micro- and Nanosystems 11 CMOS Microsystems 14 CMOS-compatible Micromachining Process Modules 17 Bulk Micromachining 18 Surface Micromachining 22 CMOS-compatible Design of MEMS and NEMS 23 Tolerable Process Modifications 24 Design Rule Modifications 26 Simulation of Circuitry and .

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