TAILIEUCHUNG - Package Mechanical Drawings

The landmark paper by Gleiter [1] redirected a significant portion of the global research efforts in materials science. The importance of this paper can be gauged by its 1300+ cita- tions and the thousands of papers that appeared on this topic since its publication. Actually, this paper was preceded by an earlier, lesser known Gleiter paper, from 1983 [2]. In this paper, Gleiter points out the outstanding possibilities of what he called then ‘‘microcrystalline materials’’. The name ‘‘nanocrystalline’’ has since taken over. The mechanical behavior of nanocrystalline materials has been the theme of approximately 500 publications. A significant number of review articles have been published. Table 1 shows. | CMicrosemi. Package Mechanical Drawings Revision 44 Naming Conventions This document lists all package types used for Microsemi FPGAs and provides detailed drawings and dimensions. Table 1 lists the package types their acronyms and the naming convention used when referring to a package of that type with a particular pin count. Table 1 Package Naming Conventions Package Type Package Name Acronym Package Pin Naming Convention example Ceramic Packages Ceramic Pin Grid Array CPGA PG84 Ceramic Quad Flat Pack CQFP CQ208 Ceramic Chip Carrier Land Grid Substrate CCLG CC256 Ceramic Column Grid Array CCGA CG484 Ceramic Land Grid Array CLGA LG484 Plastic Packages leadframe-based peripheral leads Quad Flat No Lead QFN QN48 Plastic Quad Flat Pack PQFP PQ208 Thin Quad Flat Pack TQFP TQ144 Very Thin Quad Flat Pack VQFP VQ176 Plastic Quad Flat Pack exposed heatsink RQFP RQ208 Plastic Leaded Chip Carrier PLCC PL44 Plastic Packages substrate-based area array pins Plastic Ball Grid Array mm pitch PBGA BG272 Fine Pitch Plastic Ball Grid Array mm pitch FBGA FG144 Chip Scale Package mm pitch CSP CS81 Chip Scale Package mm pitch CSP CS49 Micro Chip Scale Package UCS UC36 Very Fine Ball Pitch Grid Array VFPBA VF400 Note Currently the CS49 CS128 CS180 and CS289 packages are mm pitch rather than mm pitch. April 2013 2013 Microsemi Corporation 1 Microsemi Ceramic Pin Grid Array CPGA Ceramic Pin Grid Array CPGA PG84 Top View Orientation Bottom View Pin Notes 1. All dimensions are in inches unless otherwise stated. 2. BSC Basic spacing between centers. Supported Devices A1010B A1020B 2 Revision 44 Ỉ Microsemi Package Mechanical Drawings Ceramic Pin Grid Array PG100 Top View Side View Pin Bottom View Notes 1. All dimensions are in inches unless otherwise stated. 2. BSC Basic spacing between centers. Supported Devices A1225XL A1415A Note This product is obsolete. Revision 44

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