TAILIEUCHUNG - Báo cáo hóa học: " Nanoscale characterization of electrical transport at metal/3C-SiC interfaces"

Tuyển tập báo cáo các nghiên cứu khoa học quốc tế ngành hóa học dành cho các bạn yêu hóa học tham khảo đề tài: Nanoscale characterization of electrical transport at metal/3C-SiC interfaces | Eriksson et al. Nanoscale Research Letters 2011 6 120 http content 6 1 120 o Nanoscale Research Letters a SpringerOpen Journal NANO EXPRESS Open Access Nanoscale characterization of electrical transport at metal 3C-SiC interfaces 1 3 4 1 1 Jens Eriksson Fabrizio Roccaforte Sergey Reshanov Stefano Leone Filippo Giannazzo Raffaella LoNigro Patrick Fiorenza1 Vito Raineri1 Abstract In this work the transport properties of metal 3C-SiC interfaces were monitored employing a nanoscale characterization approach in combination with conventional electrical measurements. In particular using conductive atomic force microscopy allowed demonstrating that the stacking fault is the most pervasive electrically active extended defect at 3C-SiC 111 surfaces and it can be electrically passivated by an ultraviolet irradiation treatment. For the Au 3C-SiC Schottky interface a contact area dependence of the Schottky barrier height FB was found even after this passivation indicating that there are still some electrically active defects at the interface. Improved electrical properties were observed in the case of the Pt 3C-SiC system. In this case annealing at 500 C resulted in a reduction of the leakage current and an increase of the Schottky barrier height from to eV . A structural analysis of the reaction zone carried out by transmission electron microscopy TEM and X-ray diffraction showed that the improved electrical properties can be attributed to a consumption of the surface layer of SiC due to silicide Pt2Si formation. The degradation of Schottky characteristics at higher temperatures up to 900 C could be ascribed to the out-diffusion and aggregation of carbon into clusters observed by TEM analysis. Introduction With respect to the hexagonal silicon carbide polytype 4H-SiC cubic silicon carbide 3C-SiC has potential advantages for power device applications specifically in terms of higher electron mobility in metal oxide semiconductor .

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