TAILIEUCHUNG - Báo cáo hóa học: " Thermal conductivity and thermal boundary resistance of nanostructures"

Tuyển tập báo cáo các nghiên cứu khoa học quốc tế ngành hóa học dành cho các bạn yêu hóa học tham khảo đề tài: Thermal conductivity and thermal boundary resistance of nanostructures | Termentzidis et al. Nanoscale Research Letters 2011 6 288 http content 6 1 288 o Nanoscale Research Letters a SpringerOpen Journal NANO REVIEW Open Access Thermal conductivity and thermal boundary resistance of nanostructures 123 4 5 Konstantinos Termentzidis 11 1 Jayalakshmi Parasuraman 1 Carolina Abs Da Cruz 111 Samy Merabia 1 f l Ạ nnolocr I I4 EroHori - h l rfx 4 Rmi irmi fir ll4 y x ior IZIohor6 D7 i ri C1 nÍTonno1 213 PHiIRtỉccoí 4 Dan Angelescu 1 Fiédéiic Maliy 1 laiik Douiouina 1 xaviei Kiebei 1 Patiice CiianLienne and Philippe Dassel Abstract We present a fabrication process of low-cost superlattices and simulations related with the heat dissipation on them. The influence of the interfacial roughness on the thermal conductivity of semiconductor semiconductor superlattices was studied by equilibrium and non-equilibrium molecular dynamics and on the Kapitza resistance of superlattice s interfaces by equilibrium molecular dynamics. The non-equilibrium method was the tool used for the prediction of the Kapitza resistance for a binary semiconductor metal system. Physical explanations are provided for rationalizing the simulation results. PACS Introduction Understanding and controlling the thermal properties of nanostructures and nanostructured materials are of great interest in a broad scope of contexts and applications. Indeed nanostructures and nanomaterials are getting more and more commonly used in various industrial sectors like cosmetics aerospace communication and computer electronics. In addition to the associated technological problems there are plenty of unresolved scientific issues that need to be properly addressed. As a matter of fact the behaviour and reliability of these devices strongly depend on the way the system evacuates heat as excessive temperatures or temperature gradients result in the failure of the system. This issue is crucial for thermoelectric .

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