TAILIEUCHUNG - FLEXIBLE ELECTRONICS: MATERIALS AND DEVICE FABRICATION

This dissertation will outline solution processable materials and fabrication techniques to manufacture flexible electronic devices from them. Conductive ink formulations and inkjet printing of gold and silver on plastic substrates were examined. Line patterning and mask printing methods were also investigated as a means of selective metal deposition on various flexible substrate materials. These solution-based manufacturing methods provided deposition of silver, gold and copper with a controlled spatial resolution and a very high electrical conductivity. All of these procedures not only reduce fabrication cost but also eliminate the time-consuming production steps to make basic electronic circuit components | FLEXIBLE ELECTRONICS MATERIALS and DEVICE FABRICATION by Nurdan Demirci Sankir Dissertation submitted to the Faculty of Virginia Polytechnic Institute and State University In partial fulfillment of the requirements for the degree of DOCTOR OF PHILOSOPHY in Materials Science and Engineering APPROVED Richard O. Claus Chairman Sean Corcoran Guo-Quan Lu Daniel Stilwell Dwight Viehland December 7 2005 Blacksburg Virginia Keywords flexible electronics organic electronics organic semiconductors electrical conductivity line patterning inkjet printing field effect transistor. Copyright 2005 Nurdan Demirci Sankir FLEXIBLE ELECTRONICS MATERIALS and DEVICE FABRICATION by Nurdan Demirci Sankir ABSTRACT This dissertation will outline solution processable materials and fabrication techniques to manufacture flexible electronic devices from them. Conductive ink formulations and inkjet printing of gold and silver on plastic substrates were examined. Line patterning and mask printing methods were also investigated as a means of selective metal deposition on various flexible substrate materials. These solution-based manufacturing methods provided deposition of silver gold and copper with a controlled spatial resolution and a very high electrical conductivity. All of these procedures not only reduce fabrication cost but also eliminate the time-consuming production steps to make basic electronic circuit components. Solution processable semiconductor materials and their composite films were also studied in this research. Electrically conductive ductile thermally and mechanically stable composite films of polyaniline and sulfonated poly arylene ether sulfone were introduced. A simple chemical route was followed to prepare composite films. The electrical conductivity of the films was controlled by changing the weight percent of conductive filler. Temperature dependent DC conductivity studies showed that the Mott three dimensional hopping mechanism can be used to explain the conduction .

• Cơ khí - Chế tạo máy
• outline solution
• fabrication techniques
• processable materials
• ink formulations
• plastic substrates
• reduce fabrication