TAILIEUCHUNG - Fabrication of CMOS Integrated Circuits

3D printers are the fastest growing type of personal manufacturing machine, and perhaps the best publicized by the popular press. 3D printers use as an additive process, meaning they make objects by systematically depositing a chosen raw material in layers. Somewhat similar in concept to that of an inkjet printer that orchestrates different colored print cartridges to form an image onto paper, the most common household 3D printing process involves a “print head” that works with any material that can be extruded, or squirted through a nozzle. Another common type of 3D printer uses a laser beam. | Chapter 3 Fabrication of CMOS Integrated Circuits Jin-Fu Li Department of Electrical Engineering National Central University Jhongli Taiwan Outline Background The CMOS Process Flow Latchup Antenna Rules Layer Density Rules CMOS Process Enhancements Summary Advanced Reliable Systems ARES Lab. Jin-Fu Li EE NCU 2 Introduction An integrated circuit is created by stacking layers of various materials in a pre-specified sequence Both the electrical properties of the material and the geometrical patterns of the layer are important in establishing the characteristics of devices and networks Most layers are created first and then patterned using lithographic sequence Doped silicon layers are the exception to this rule Advanced Reliable Systems ARES Lab. Jin-Fu Li EE NCU

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