TAILIEUCHUNG - Wide Spectra of Quality Control Part 19

Tham khảo tài liệu 'wide spectra of quality control part 19', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | 530 Wide Spectra of Quality Control was repeated 20 times for every board. The dye staining analysis was carried out to confirm if any solder cracks occurred in CPU BGAs on the PCB. Optical microscopy was used to inspect the dyed areas and determine the failure mode classification. The test results showed that the solder balls at one outermost corner had been dyed indicating that many solder joint cracks were found in the corner of the component. Figure 29 is an optical picture taken after the dye staining process. In order to accurately interpret the dye staining results two photos from the PCB pad side and component BGA side are compared together to find out the right failure mode of the dyed areas. For example Fig. 29 a corresponds with Fig. 29 c . Dye propagation and magnitude from both sides provide the main judgment criteria regarding whether cracks occur. Following the dyeing process the failed solder joints are identified and the failure mode classification can be defined. Figs. 30 a and b are enlarged photos showing several failed solder joints. The failure mode of these solder joint cracks is between the component pad and the solder ball which is Type 2 based on the classification of failure mode. Figure 30 c shows the classification of the magnitude of the dye penetration. With respect to the magnitude of the dye penetration Types B C and D of high percentage crack sizes can be seen in the photos indicating severe solder joint cracks occurring after a slight variation to the ICT fixture. 6. Conclusions This study investigates PCB material performance and failure phenomenon during harsh assembly processes such as thermal shock and moisture exposure. Materials with a combination of Tg levels and Dicy Phenolic curing agent were considered. All materials passed the assembly process verification and no PCB failure was observed. The high Tg material with a Phenolic curing agent is suggested for use in lead-free processes. Black pad is a notable failure symptom

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