TAILIEUCHUNG - Thermal distribution and reliability prediction for 3D Networks-on-chip

In this work, we have investigated the impact of the thermal dissipation difficulty of Network on Chip based 3D-ICs by proposing a method to predict the temperature and MTTF of each region of the targeted system. | VNU Journal of Science Comp. Science amp Com. Eng Vol. 36 No. 1 2020 65-77 Original Article Thermal Distribution and Reliability Prediction for 3D Networks-on-Chip Khanh N. Dang1 Akram Ben Ahmed2 Abderazek Ben Abdallah3 Xuan-Tu Tran1 1 VNU University of Engineering and Technology Vietnam National University Hanoi 144 Xuan Thuy Cau Giay Hanoi Vietnam 2 National Institute of Advanced Industrial Science and Technology AIST Tsukuba 305-8568 Japan 3 University of Aizu Aizu-Wakamatsu Japan Received 02 April 2020 Revised 02 June 2020 Accepted 06 June 2020 Abstract As one of the most promising technologies to reduce footprint power consumption and wire latency Three Dimensional Integrated Circuits 3D-ICs is considered as the near future for VLSI system. Combining with the Network-on-Chip infrastructure to obtain 3D Networks-on- Chip 3D-NoCs the new on-chip communication paradigm brings several advantages. However thermal dissipation is one of the most critical challenges for 3D-ICs where the heat cannot easily transfer through several layers of silicon. Consequently the high-temperature area also confronts the reliability threat as the Mean Time to Failure MTTF decreases exponentially with the operating temperature as in Black s model. Apparently 3D-NoCs and 3D ICs must tackle this fundamental problem in order to be widely used. However the thermal analyses usually require complicated simulation and might cost an enormous execution time. As a closed-loop design flow designers may take several times to optimize their designs which significantly increase the thermal analyzing time. Furthermore reliability prediction also requires both completed design and thermal prediction and designer can use the result as a feedback for their optimization. As we can observe two big gaps in the design flow it is difficult to obtain both of them which put 3D-NoCs under thermal throttling and reliability threats. Therefore in this work we investigate the thermal distribution and reliability

• Hệ điều hành
• Thermal dissipation
• Communication engineering
• Computer science
• Three dimensional integrated circuits
• Through Silicon Via
• Static thermal analysis of fins models using ansys
• Static thermal analysis
• Fins models using ansys
• Design of fins
• The heat dissipation rate